High-Density Interconnect (HDI) PCBs represent a significant leap forward in circuit board technology, enabling miniaturization and enhanced performance. As devices continue to shrink while functionality expands, HDI technology becomes essential for everything from smartphones to medical implants.
Smartphones, tablets, and wearables rely heavily on HDI to pack functionality into minimal space. Modern devices feature 20+ layer HDI boards with dense microvia structures.
Pacemakers, insulin pumps, and imaging devices all leverage HDI technology for compact, reliable performance.
Mission-critical systems demand the reliability HDI provides ā including avionics, satellite communications, and guidance systems.
COā and UV lasers precisely create microvias with minimal thermal damage to surrounding materials. Our facility uses state-of-the-art systems capable of 50Āµm-diameter vias.
HDI designs often require multiple lamination cycles, each adding complexity. Engineers optimize registration to maintain 25Āµm alignment tolerances.
Microvia plating requires specialized chemistry to ensure reliability and mitigate voids.
Our engineering team brings decades of HDI experience to your project ā from initial design review through final testing.
Contact our team to discuss your PCB manufacturing needs and get a custom quote.
Request a Quote