Xekera Systems offers a comprehensive range of surface finish options to meet your specific application requirements. Each finish provides unique benefits for solderability, shelf life, and performance characteristics.
Solder is deposited on features not covered with solder mask. Solder thickness varies from 0.2 to 1.2 mils. This variation is due to board circuit density and aspect ratio. Solder consists of 63%/37% eutectic Tin/Lead.
A transparent organic coating is deposited on features that are not covered with solder mask.
Electroless nickel and electroless gold are deposited on features not covered with solder mask. Thickness for nickel is between 80 and 150 microinches, and gold thickness is 3-6 microinches.
Electrolytic nickel-gold is deposited on solderable features. Typically, 150-200 microinches of nickel is deposited, and 5-10 microinches of hard gold. Gold flash is applied to features after pattern copper plating.
Silver is deposited on features not covered with solder mask. Thickness of silver is 4 to 20 microinches.
Immersion tin is deposited on features not covered with solder mask. Thickness is typically 30-40 microinches.
A conductive carbon paste is applied on selective pads for contact purposes, e.g., keypads of calculators, etc.
Electrolytic soft gold is plated on features that require bondable gold for wire bonding applications. Depending on the type of wire bonding used, the thickness of gold varies from 20 to 50 microinches. Nickel thickness is between 150 and 250 microinches.
Our team of experts can help you choose the optimal surface finish for your application based on performance requirements, budget, and manufacturing volume. Contact us today for personalized recommendations.
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