Our Assembly Capabilities

SMT Assembly

Advanced surface mount technology for components down to 0201 size with high-speed automated placement.

  • Fine-pitch components (0.3mm pitch)
  • BGA, QFN, LGA packages
  • 01005, 0201 passive components

Through-Hole Assembly

Traditional through-hole insertion for robust mechanical connections and high-power components.

  • Wave soldering
  • Selective soldering
  • Hand assembly for specialty components

Mixed Technology

Combine SMT and through-hole on the same board for optimal design flexibility.

  • Both automated and manual processes
  • Optimized assembly sequence
  • Quality inspection at each stage

Conformal Coating

Protective coatings for harsh environments and improved reliability.

  • Acrylic, silicone, urethane coatings
  • Selective coating capabilities
  • Environmental protection

Volume & Turnaround Capabilities

Prototype
1-10 boards 3-5 days
Low Volume
10-100 boards 5-7 days
Medium Volume
100-1,000 boards 1-2 weeks
High Volume
1,000+ boards 2-4 weeks

State-of-the-Art Equipment

SMT Lines
  • High-speed pick and place machines
  • Automated optical inspection (AOI)
  • Reflow ovens with precise thermal profiles
  • Solder paste inspection (SPI)
Through-Hole
  • Wave soldering systems
  • Selective soldering for mixed assemblies
  • Manual insertion stations
  • Pin-in-paste technology

Ready to Start Your Assembly Project?

From prototype to production, we have the capabilities to meet your assembly needs. Contact us today for a detailed quote and timeline.

Get Started