Quality assurance is paramount at Xekera Systems. We employ comprehensive testing protocols to ensure every PCB meets the highest standards of reliability and performance before delivery.
Comprehensive electrical continuity and isolation testing to ensure all connections are properly formed.
Controlled impedance testing for high-speed signals with ±5% or ±10% tolerance.
Cross-sectional analysis to verify layer registration, plating thickness, and via quality.
Accelerated thermal stress testing to validate reliability under temperature variations.
Ensures surface finish provides excellent solder wetting and adhesion.
Precision measurement to verify board dimensions, hole sizes, and feature placement.
All our testing procedures comply with international standards to ensure the highest quality and reliability:
All materials and components undergo rigorous incoming quality control.
Critical checkpoints throughout fabrication ensure quality at every step.
Comprehensive final testing before packaging and shipment to customers.
Our rigorous testing protocols ensure that every PCB leaving our facility meets or exceeds industry standards. Contact us to learn more about our quality assurance processes.
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