High-Density Interconnect (HDI) technology enables smaller, lighter, and more complex PCB designs. Our advanced HDI capabilities support the most demanding applications in consumer electronics, medical devices, and high-performance computing.
Up to 6+N+6 build-up with stacked and staggered microvia configurations for maximum routing density.
Copper-filled and resin-plugged via-in-pad for BGA, QFN, and other high-density packages.
Precision laser drilling down to 0.002" for microvias with exceptional accuracy and repeatability.
CO2 and UV laser drilling for precise microvia formation
Build-up process for complex multilayer HDI structures
Conductive and non-conductive via fill options
Our engineering team has extensive experience with complex HDI designs. Contact us to discuss your high-density interconnect requirements.
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