XEKERA
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Manufacturing Technologies

Xekera Systems employs state-of-the-art manufacturing technologies to deliver PCBs with tight tolerances and exceptional quality. Our standard and advanced capabilities cover a wide range of applications from prototyping to high-volume production.

General Manufacturing Specifications

Item
Standard
Advanced
Min Line/Spacing, Internal
3/3 mils
3/3 mils
Min Line/Spacing, External
4/4 mils
3/3 mils
Minimum Drilled Hole Size
8 mils
6 mils
Aspect Ratio (Thickness to Drill)
10:1
15:1
Annular Ring (Diameter over Drill)
10 mils
8 mils
Anti-pad (Diameter over Drill)
20 mils
16 mils
Plated Hole Tolerance
±3 mils
±2 mils
Minimum Dielectric Thickness
3 mils
2 mils
Maximum PCB Thickness
0.200"
0.250"
Thickness Tolerance
±10%
±7%
Maximum PCB Dimensions
16.0" x 22.0"
30.0" x 44.0"
Fabricated Dimensions – NC Routing
±5 mils
±3 mils
Layer-to-Layer Registration
±5 mils
±3 mils
Solder Mask Clearance, Per Side
2.0 mils
1.5 mils
Blind/Buried Vias (All types)
yes
yes
Via Fill (Conductive, Non-Conductive)
no
yes

Inner Layer Specifications

Parameter
Standard
Advanced
Minimum Core Thickness
3 mils
2 mils
Minimum Line Width
4 mils
3 mils (½ Oz copper)
Minimum Spacing (Air gap)
4 mils
3 mils (½ Oz copper)
Minimum Pad Size
Drill size + 10 mils
Drill Size + 7 mils
Minimum Anti-Pad (planes)
Drill Size + 20 mils
Drill Size + 16 mils

Outer Layer Specifications

Parameter
Standard
Advanced
Max Finished Thickness
0.200"
0.250"
Thickness Tolerance
±10%
±5%
Max Aspect Ratio
10:1
12:1
Min Drill Size
10 mils
8 mils
Min Line Width
4 mils
3 mils
Min Spacing (Air Gap)
4 mils
3 mils
Min Solder Mask Clearance
4 mils
3 mils
Min Solder Mask Web Thickness
4 mils
3.4 mils

Advanced Manufacturing Capabilities

Drilling & Routing
  • Laser drilling for micro-vias (2-6 mils)
  • High aspect ratio drilling (up to 15:1)
  • Back drilling for stub removal
  • CNC routing with ±3 mil tolerance
Via Technologies
  • Blind and buried vias
  • Stacked micro-vias
  • Via-in-pad with conductive fill
  • Non-conductive via fill
Lamination
  • Sequential build-up (SBU) lamination
  • Vacuum lamination for void-free bonding
  • Mixed dielectric construction
  • Controlled thermal profiles
Impedance Control
  • Single-ended impedance (±5% or ±10%)
  • Differential pairs (±5% or ±10%)
  • TDR testing for verification
  • High-frequency materials up to 100 GHz

Need Tighter Tolerances?

Our advanced capabilities can meet even the most demanding specifications. Contact our engineering team to discuss your specific requirements and learn how we can support your project.

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