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PCB Assembly Rework

Xekera Systems offers expert PCB assembly rework services to repair defective boards and replace failed components. Our skilled technicians use advanced equipment to perform delicate rework operations with minimal risk to the board.

Rework Services

BGA Rework

Precision removal and replacement of ball grid array components using specialized equipment.

Component Replacement

SMT and through-hole component removal and replacement with minimal board damage.

Failure Analysis

Root cause analysis to identify defects and prevent future occurrences.

Board Refurbishment

Complete board cleaning, repair, and recoating to extend product life.

BGA Rework Process

BGA rework requires specialized equipment and expertise. Our process ensures successful component removal and replacement:

1
X-Ray Inspection

Verify defect location

2
Component Removal

Controlled heating and extraction

3
Pad Preparation

Clean and re-level pads

4
Component Replacement

Precise placement and reflow

5
Final Inspection

X-ray and functional test

Common Rework Scenarios

  • Wrong Component Installed: Replace incorrectly placed components with correct parts
  • Solder Joint Defects: Repair cold joints, bridges, and insufficient solder
  • Component Damage: Replace cracked, lifted, or otherwise damaged components
  • Field Failures: Diagnose and repair returned boards from the field
  • Design Changes: Implement ECO (Engineering Change Order) modifications

Rework Equipment

BGA Rework Stations
  • Automated optical alignment
  • Split-vision capability for precise placement
  • Closed-loop temperature control
  • Under-board and top-side heating
Inspection Equipment
  • X-ray inspection systems
  • Stereo microscopes with digital imaging
  • AOI for post-rework verification
  • In-circuit and functional test

Expert Rework Services

Whether you need a single component replaced or full board refurbishment, our experienced team can help. Contact us today to discuss your rework needs.

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