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Flex PCB Capability

Flex capability, material selection, process tolerances, manufacturing logistics, and supplier expertise all play an important role in producing cost-effective and reliable flex circuit designs. At Xekera Systems Inc, we assist you in design for PCB manufacturing to minimize overall program costs.

Material Selection

Material
Specification
Polyimide Thickness
0.0005" (12 um), 0.001" (25 um), 0.002"(50 um), 0.003" (75 um), 0.005" (125 um)
Copper (thickness)
0.25 oz.(9 um), 0.33 oz.(12 um), 0.5 oz. (17 um), 1 oz.(35 um), 2 oz.(70 um)
Copper Foils (rolled-annealed)
Polyimide, Polyester, LPI (liquid photo imageable), PIC(photo imageable cover coat)
Stiffeners
FR-4, Polyimide, Metal, or customer supplied
Thermo-bond Adhesives
Acrylic, Phenolic Butyral, Modified Epoxy
Surface Finishes
Solder (HAL), Electrolytic Soft Bondable Gold, Hard Gold, ENIG, Entek 106A, Immersion Tin

Process Capabilities and Tolerances

Parameter
Value
Minimum Trace/Space
0.0015"/0.002" (0.33 oz.), 0.002"/0.0025" (0.5 oz.), 0.003"/0.0035" (1 oz.)
Minimum Via Hole Diameter (before plating)
0.006" (NC Drill), 0.002" (UV Laser)
Minimum Blind Via Diameter (before plating)
0.004" (UV Laser)
Trace to Edge Distance
0.010" (NC Route), 0.008" (Die Punch), 0.001" (UV Laser)
Trace to Edge Tolerance
0.005" (NC Route), 0.003" (Die Punch), 0.001" (UV Laser)
Cover Layer Aperture Positional Tolerance
0.005" (Cover Film), 0.002" (LPI and PIC), 0.001" (Laser Ablation)

* Trace to edge distance should be greater than 0.003" for proper copper insulation

** Laser defined apertures created by ablating cover layer material

Need Tighter Tolerances or Special Process Treatments?

Come speak with us if your design requires specifications beyond our standard capabilities. We're here to help you achieve your manufacturing goals.

Contact Our Team