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ENEPIG Plating

Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) is a premium surface finish offering the best combination of solderability, wire bondability, and corrosion resistance. Ideal for high-reliability applications requiring multiple assembly processes.

ENEPIG Advantages

Multi-Layer Protection

Seven-metal layer stack provides superior corrosion resistance and bondability.

Black Pad Prevention

Eliminates black pad defects common with ENIG, ensuring reliable solder joints.

Excellent Solderability

Palladium layer provides exceptional wetting and solder joint integrity.

Wire Bonding Compatible

Supports both gold and aluminum wire bonding for hybrid assemblies.

ENEPIG Layer Structure

7. Immersion Gold (Au) 0.05-0.10 µm - Protects palladium from oxidation
6. Electroless Palladium (Pd) 0.05-0.15 µm - Primary soldering surface
5. Electroless Nickel (Ni) 3-5 µm - Diffusion barrier and structural support
Copper Base Material PCB copper traces

Technical Specifications

Typical Thickness
  • Nickel (Ni): 3-5 micrometers
  • Palladium (Pd): 0.05-0.15 micrometers
  • Gold (Au): 0.05-0.10 micrometers
  • Total stack: ~3-6 micrometers
Key Properties
  • Shelf life: 12+ months
  • Multiple reflow capable
  • RoHS and REACH compliant
  • Suitable for lead-free assembly

Ideal Applications

  • High-reliability electronics requiring both soldering and wire bonding
  • Medical devices and implantable electronics
  • Aerospace and military applications (MIL-spec)
  • Automotive electronics (AEC-Q qualified)
  • Fine-pitch components (0.4mm pitch and below)
  • Products requiring extended shelf life

ENEPIG vs ENIG Comparison

Feature
ENEPIG
ENIG
Black Pad Resistance
Excellent
Risk present
Wire Bonding
Gold & Aluminum
Gold only
Shelf Life
12+ months
~12 months
Cost
Premium
Standard

Premium Surface Finish for Critical Applications

ENEPIG provides the ultimate combination of reliability and versatility. Contact us to learn if ENEPIG is right for your application.

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