PCB Layer Configurations

Single-Layer PCBs

For simple circuits, copper traces only on one layer—bottom layer for through-hole components, upper layer for SMDs.

Double-Layer PCBs

Copper traces on both top and bottom layers connected by vias. Used for moderately complex circuits with both through-hole and SMD components.

Multi-Layer PCBs

1-40+ layers with various types of vias (through-hole, buried, blind). Essential for complex circuits requiring high density and controlled impedance.

Advantages of Multi-Layer PCBs

High Design Flexibility

Multiple layers provide extensive routing options, enabling complex circuit designs with optimal signal integrity.

Reduced Board Size

Vertical stacking of layers allows for compact designs, essential for modern portable electronic devices.

Improved Signal Integrity

Dedicated ground and power planes reduce noise and crosstalk, critical for high-speed digital circuits.

Enhanced Performance

Better control of impedance and EMI/EMC characteristics for reliable high-frequency operation.

Why Choose Multilayer PCBs?

As a multi-layer PCB manufacturer, Xekera Systems makes high quality PCBs for our customers. The advantage of using a multi-layer board is the designer can use multiple layers for all the traces they require to connect their components on the board.

  • High Precision and Density: Large-scale integrated circuits with high density and digitization levels
  • Impedance Control: Better control of single-ended and differential impedance for high-speed signals
  • Signal Integrity: Improved signal integrity for high-frequency applications
  • Compact Products: Essential for small products like mobile phones and pocket recorders

Structure of Multilayer PCBs

As a multi-layer PCB manufacturer, Xekera Systems starts with the core, usually an FR4 material that gives the board its rigidity. Our comprehensive manufacturing process ensures optimal quality:

Core Layer

FR4 material provides rigidity with copper clad affixed using epoxy resin. Each side of the core has copper for circuit traces.

Build-Up Layers

Prepreg acts as insulation and dielectric along with copper clad to build the stackup. Thickness is adjusted to reach final board specification.

Processing

Each copper layer undergoes photo-imaging, etching, and drilling before addition to the stackup. Drilling creates necessary vias for interconnection.

Finishing

Top and bottom layers receive solder resist printing, surface finish, and legend printing before assembly.

Industry Applications

Most manufacturers of electronic products use multilayer PCBs as they offer high design flexibility, stability, and reliable device performance:

Consumer Electronics
Telecommunications
Medical Devices
Aerospace & Defense
Automotive Systems
Industrial Controls
Computing Equipment
IoT Devices
Wearable Technology

Get a Free Quote on Your Multi-Layer Board

Give us a call and start the process of converting your design to reality. Whether you need prototypes or high-volume production, Xekera Systems delivers exceptional multilayer PCBs tailored to your specifications.

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