Xekera Systems offers soft gold plating services specifically optimized for gold ball wire bonding applications. Our electroplated soft gold provides the ideal surface for wire bonding in semiconductor packaging and hybrid microelectronics.
Soft gold provides excellent wire bonding characteristics for gold ball wire bonding applications.
Gold plating offers outstanding protection against oxidation and corrosion.
Pure gold ensures excellent electrical conductivity for high-reliability connections.
Precise thickness control and hardness specifications for consistent bonding results.
Thorough surface preparation
Adhesion layer plating
Diffusion barrier
Controlled thickness deposition
XRF thickness verification
Our soft gold plating services ensure optimal wire bonding performance for your critical applications. Contact us to discuss your requirements.
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