Core Capabilities

  • High-speed digital design (DDR4, DDR5, PCIe, USB 3.x)
  • RF and microwave circuit design
  • Mixed-signal and analog circuit design
  • Power supply and power management design
  • High-power and high-temperature applications
  • Signal integrity and power integrity analysis
  • Electromagnetic compatibility (EMC) design
  • Thermal analysis and management
  • CE/FCC/ISO/ROHS compliance
  • Design for manufacturability (DFM)

High-Speed Digital

Design and analysis of high-speed digital interfaces including DDR4/DDR5 memory, PCIe Gen 3/4/5, USB 3.x, HDMI, DisplayPort, and Ethernet. Full signal integrity simulation and validation.

RF & Microwave

RF circuit design from DC to 100+ GHz. Antenna design, matching networks, filters, amplifiers, and complete RF front-end design. Experience with cellular, WiFi, Bluetooth, and custom RF protocols.

Mixed-Signal & Analog

Precision analog design including data acquisition, sensor interfaces, audio circuits, and low-noise amplification. ADC/DAC integration and mixed-signal PCB layout expertise.

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