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Ball Grid Array Assembly

Xekera Systems specializes in BGA assembly for high-density electronics. Our advanced equipment and experienced technicians ensure reliable solder joints for even the most challenging ball grid array packages.

BGA Assembly Capabilities

Fine-Pitch BGA

Experience with BGAs down to 0.3mm pitch for advanced processors and FPGAs.

X-Ray Inspection

100% X-ray inspection ensures proper solder ball formation and void-free joints.

Precise Thermal Profiling

Optimized reflow profiles prevent warpage and ensure reliable solder joints.

Rework Capabilities

Specialized BGA rework stations for repair and component replacement.

BGA Package Types We Support

Standard BGA
Fine-Pitch BGA (FBGA)
Plastic BGA (PBGA)
Ceramic BGA (CBGA)
Tape BGA (TBGA)
Package-on-Package (PoP)
Chip-Scale Package (CSP)
Land Grid Array (LGA)

Our BGA Assembly Process

  • Precise Stencil Design: Custom stencils optimized for each BGA footprint
  • Solder Paste Inspection: 3D SPI verifies paste volume and placement before component placement
  • High-Accuracy Placement: Vision-guided placement ensures proper alignment
  • Controlled Reflow: Nitrogen atmosphere and optimized thermal profiles prevent defects
  • X-Ray Inspection: 100% automated X-ray inspection verifies solder joint quality

Quality Assurance for BGAs

BGA assembly requires exceptional process control. We employ multiple inspection technologies to ensure reliability:

Pre-Reflow

3D solder paste inspection ensures proper paste volume and no bridging before component placement.

Post-Reflow

Automated X-ray inspection detects voids, insufficient solder, and other hidden defects.

Functional Test

In-circuit and functional testing verify electrical connectivity and performance.

Expert BGA Assembly

Trust our experienced team for your most challenging BGA assembly projects. Contact us to discuss your requirements.

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