In electronics manufacturing, quality isn’t just a goal — it’s a requirement. A single defective solder
joint can cause product recalls, damage reputation, or in mission-critical applications, endanger lives.
At Xekera we build comprehensive quality systems that catch defects before they leave our facility.
The True Cost of Poor Quality
Consider what’s at risk:
- Field failures: Fixing a product in the field costs far more than preventing the issue in manufacturing.
- Recall expenses: Logistics, repairs, and reputational damage can run into millions.
- Liability: In medical and aerospace applications failures can lead to injury or legal action.
Inspection Technologies
Modern PCB assembly employs multiple inspection technologies — each suited to specific defect types.
Solder Paste Inspection (SPI)
SPI systems measure solder paste deposits before component placement:
- Volume: ensure correct paste for reliable joints
- Height: detect printing issues
- Area: verify paste position on pads
- Shape: identify bridging risks
SPI typically catches the majority of printing defects prior to assembly.
Automated Optical Inspection (AOI)
After reflow, AOI captures high-resolution images and uses algorithms to detect:
- Missing or misaligned components
- Solder bridges and opens
- Polarity errors
- Tombstoning and lifted leads
AOI systems can inspect thousands of joints per second with high detection rates.
X-Ray Inspection (AXI)
X-ray reveals defects hidden beneath components and inside joints:
- BGA and QFN solder joint inspection
- Through-hole barrel fill and penetration
- Voids and internal delamination
Functional & In-Circuit Testing
Beyond visual/X-ray inspection, electrical testing verifies every board operates as intended:
- ICT (In-Circuit Test): checks component placement, shorts/opens and basic functionality.
- Functional Test: system-level verification to simulate real usage and validate performance.
Process Controls & Traceability
Preventing defects is better than finding them. Our process controls include:
- Realtime monitoring of reflow profiles and solder paste volumes
- Component lot tracking linked to production records
- First-pass yield tracking and corrective action workflows
- Complete traceability for failure analysis
Continuous Improvement
We analyze defect data to drive improvement:
- Pareto analysis of defect types
- Root cause investigations
- Corrective & preventive actions (CAPA)
- Design for Manufacturability (DFM) feedback to design teams
Industry Standards & Certifications
Different industries require different quality standards. Xekera maintains compliance and certifications
aligned to customer needs, such as IPC classifications, ISO 13485 for medical devices, and automotive
quality processes where required.
Partner with Xekera for Quality
Our quality systems have achieved:
- High first-pass yields across product lines
- Low DPMO (defects per million opportunities)
- Zero critical escapes to customers in the last 24 months
Whether you’re building consumer devices or life-saving medical equipment, our quality systems ensure your
product meets the highest standards. Contact us to learn more about our inspection capabilities and certifications.