Technical Specifications

Parameter
Specification
Number of Layers
1-40 layers
Board Thickness
0.008" - 0.250" (0.2mm - 6.35mm)
Copper Weight
0.5oz - 13oz (18µm - 444µm)
Minimum Trace/Space
0.002" / 0.002" (0.05mm / 0.05mm)
Minimum Hole Size
0.004" (0.1mm) mechanical, 0.002" (0.05mm) laser
Hole to Hole Spacing
0.006" (0.15mm)
Annular Ring
0.002" (0.05mm) minimum
Aspect Ratio
Up to 20:1
Controlled Impedance
±5% or ±10% tolerance
Surface Finish
HASL, Lead-Free HASL, ENIG, Immersion Silver, Immersion Tin, OSP, Hard Gold, Soft Gold
Solder Mask
Green, White, Black, Red, Blue, Yellow, Matte Green, Matte Black
Silkscreen
White, Black, Yellow
Via Types
Through-hole, Blind, Buried, Micro, Stacked, Via-in-Pad
Via Fill
Conductive, Non-conductive, Resin plugged, Copper filled
Board Size (Min)
0.5" x 0.5" (12.7mm x 12.7mm)
Board Size (Max)
24" x 36" (610mm x 915mm)
Panel Size
Up to 24" x 36" (610mm x 915mm)

Advanced Capabilities

Advanced HDI

  • Laser drilling 0.002" (0.05mm)
  • Stacked microvias up to 6+N+6
  • Via-in-pad plated shut
  • Sequential lamination
  • Buried and blind vias

High Layer Count

  • Up to 40 layers
  • Controlled depth drilling
  • Impedance control
  • Buried resistors and capacitors
  • Hybrid constructions

Fine Line

  • 0.002"/0.002" trace/space
  • Semi-additive process (SAP)
  • Modified semi-additive (mSAP)
  • Ultra-fine pitch BGA
  • High density routing

Heavy Copper

  • Up to 13oz copper
  • Power distribution
  • Thermal management
  • High current applications
  • Mixed copper weights

Materials Stock

FR-4 (Standard, Mid Tg, High Tg, Halogen-Free)
Rogers (RO4003C, RO4350B, RO4835, RO3003, RO3006, RO3035)
Taconic (TLY, TLX, RF-35)
Isola (IS410, IS420, I-Tera MT40)
Polyimide
Arlon (25N, 25FR, 33N, 35N, AD255C)
Aluminum (Metal Core PCB)
Copper (Metal Core PCB)
Ceramic
Teflon (PTFE)

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